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서브컨텐츠

제품소개

Cut-DC 100
Diamond wire curve cutting system

  • x, y축을 이동하면서 사용자가 원하는 모양대로 조각이 가능하다.



    Ceramic materials : alumina ceramics, zinc oxide ceramics, zirconia ceramics, target ceramics, honeycomb ceramics, semiconductor ceramics, conductive ceramics, non-
    conductive ceramics, etc.

    Crystal materials : graphite, silicon crystal (solar poly silicon, single crystal silicon), sapphire, alumina crystal, infrared glass crystal, alumina crystal, silicon carbide crystal, cesium
    iodide crystal, etc.

    Glass materials: sulfur glass, optical glass, quartz glass, infrared glass, glass tube, etc.
견적문의

 

                                                        

주요 사양   

X-axis travel distance

200mm

Y-axis travel distance

300mm

Max. Cutting depth

50mm

Wire Moving Speed

0-15m/s

X/Y-axis Moving Speed

0.6-60mm/min

Sample stage size

220 x 450 mm

Tension model

공압식

Dimension

1250mmL x 1110mmW x 950mmH

관련 제품