| 60-20065 |
Wafering Blade, Diamond Metal Bond, High Concentration, 3" x .006" x .5" (76 x .15 x 12.7 mm)
|
|
| 60-20070 |
Wafering Blade, Diamond Metal Bond, High Concentration, 4" x .012" x .5" (102 x .31 x 12.7 mm)
|
|
| 60-20075 |
Wafering Blade, Diamond Metal Bond, High Concentration, 5" x .015" x .5" (127 x .38 x 12.7 mm)
|
|
| 60-20080 |
Wafering Blade, Diamond Metal Bond, High Concentration, 6" x .020" x .5" (152 x .51 x 12.7 mm)
|
|
| 60-20081 |
Wafering Blade, Diamond Metal Bond, High Concentration, 7" x .025" x .5" (178 x .64 x 12.7 mm)
|
|
| 60-20084 |
Wafering Blade, Diamond Metal Bond, High Concentration, 8" x .030" x .5" (203 x .76 x 12.7 mm)
|
|
| 60-20085 |
Wafering Blade, Diamond Metal Bond, Low Concentration, 3" x .006" x .5" (76 x .15 x 12.7 mm)
|
|
| 60-20090 |
Wafering Blade, Diamond Metal Bond, Low Concentration, 4" x .012" x .5" (102 x .31 x 12.7 mm)
|
|
| 60-20095 |
Wafering Blade, Diamond Metal Bond, Low Concentration, 5" x .015" x .5" (127 x .38 x 12.7 mm)
|
|
| 60-20100 |
Wafering Blade, Diamond Metal Bond, Low Concentration, 6" x .020" x .5" (152 x .51 x 12.7 mm)
|
|
| 60-20101 |
Wafering Blade, Diamond Metal Bond, Low Concentration, 7" x .025" x .5" (178 x .64 x 12.7 mm)
|
|
| 60-20104 |
Wafering Blade, Diamond Metal Bond, Low Concentration, 8" x .030" x .5" (203 x .76 x 12.7 mm)
|
|
